Drop-on-demand Laser Sintering with Silver Nanoparticles for Electronics Packaging, IEEE TRANSACTIONS ON COMPONENTS, PACKAGING AND MANUFACTURING TECHNOLOGY(TEMP), Vol. 2, No. 5, May 2012 (2012)pp. 868-877
プリンテッドエレクトロニクス用レーザ焼結技術:銀ナノ粒子ペーストを用いた微細配線及び機能性膜形成,エレクトロニクス実装学会誌,Vol.15,No.1(2012)pp.96-105
Laser-sintered Porous Structures for Samarium-based Solid Oxide Fuel Cells, Proceedings of 8th International Conference on Porous Metals and Metallic Foams (Metfoam), NC, USA, June 23-26 (2013) #777
Temperature soak reliability of laser-sintered Ag pads for wire bonding,” in Proc. 13th Electron. Packag. Technol. Conf., Dec. 2011, pp. 397-400.
「セラミックスのレーザ焼結技術と固体酸化物形燃料電池への応用」, セラミックス, Vol. 49, (2014) pp. 106-111, 掲載日:2014/2/1.
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